ASUS to Unveil First Qualcomm Snapdragon X Elite-Based Laptop On May 20th
Asus on Tuesday said that it would announce its first 'AI PC' based on Qualcomm's Snapdragon X Elite system-on-chips later this month. The new laptop is set to be...
8 by on 5/7/2024Samsung Tapes Out Its First 3nm Smartphone SoC, Gets A Boost From Synopsys AI-Enabled Tools
This week Samsung Electronics and Synopsys announced that Samsung has taped out its first mobile system-on-chip on Samsung Foundry's 3nm gate-all-around (GAA) process technology. The announcement, coming from electronic...
8 by on 5/3/2024SK hynix Reports That 2025 HBM Memory Supply Has Nearly Sold Out
Demand for high-performance processors for AI training is skyrocketing, and consequently so is the demand for the components that go into these processors. So much so that SK hynix...
6 by on 5/2/2024AMD Zen 5 Status Report: EPYC "Turin" Is Sampling, Silicon Looking Great
As part of AMD's Q1'2024 earnings announcement this week, the company is offering a brief status update on some of their future products set to launch later this year...
41 by on 5/1/2024Samsung Foundry Update: 2nm Unveil in June, Second-Gen SF3 3nm Hits Production This Year
As part of Samsung's Q1 earnings announcement, the company has outlined some of its foundry unit's key plans for the rest of the year. The company has confirmed that...
4 by on 5/1/2024TSMC Readies 8x Reticle Super Carrier Interposer For Next-Gen Chips Twice as Large As Today's
TSMC is no stranger to building big chips. Besides the ~800mm2 reticle limit of their normal logic processes, the company already produces even larger chips by fitting multiple dies...
6 by on 4/30/2024TSMC Jumps Into Silicon Photonics, Lays Out Roadmap For 12.8 Tbps COUPE On-Package Interconnect
Optical connectivity – and especially silicon photonics – is expected to become a crucial technology to enable connectivity for next-generation datacenters, particularly those designed HPC applications. With ever-increasing bandwidth...
9 by on 4/26/2024TSMC's System-on-Wafer Platform Goes 3D: CoW-SoW Stacks Up the Chips
TSMC has been offering its System-on-Wafer integration technology, InFO-SoW, since 2020. For now, only Cerebras and Tesla have developed wafer scale processor designs using it, as while they have...
2 by on 4/26/2024TSMC Preps Cheaper 4nm N4C Process For 2025, Aiming For 8.5% Cost Reduction
While the bulk of attention on TSMC is aimed at its leading-edge nodes, such as N3E and N2, loads of chips will continue to be made using more mature...
6 by on 4/25/2024TSMC 2nm Update: N2 In 2025, N2P Loses Backside Power, and NanoFlex Brings Optimal Cells
Taiwan Semiconductor Manufacturing Co. provided several important updates about its upcoming process technologies at its North American Technology Symposium 2024. At a high level, TSMC's 2 nm plans remain...
0 by on 4/25/2024TSMC's 1.6nm Technology Announced for Late 2026: A16 with "Super Power Rail" Backside Power
With the arrival of spring comes showers, flowers, and in the technology industry, TSMC's annual technology symposium series. With customers spread all around the world, the Taiwanese pure play...
18 by on 4/25/2024Report: Seagate, Western Digital Hike HDD Prices Amid Surge In Demand
Seagate Technology has reportedly notified its customers abouts its plans to raise prices on new hard drive orders and for demands that exceed prior agreements, echoing a similar move...
11 by on 4/24/2024Seagate: Mozaic 3+ HAMR Hard Drives Can Last Over Seven Years
As Seagate ramps up shipments of its new heat assisted magnetic recording (HAMR)-based Mozaic 3+ hard drive platform, the company is both in the enviable position of shipping the...
13 by on 4/23/2024Samsung Starts Mass Production of 9th Generation V-NAND: 1Tb 3D TLC NAND
Samsung Electronics has started mass production of its 9th generation of V-NAND memory. The first dies based on their latest NAND tech come in a 1 Tb capacity using...
2 by on 4/23/2024JEDEC Extends DDR5 Memory Specification to 8800 MT/s, Adds Anti-Rowhammer Features
When JEDEC released its DDR5 specification (JESD79) back in 2020, the standard setting organization defined precise specs for modules with speed bins of up to 6400 MT/s, while leaving...
14 by on 4/22/2024SK Hynix and TSMC Team Up for HBM4 Development
SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The...
5 by on 4/19/2024TSMC Posts Q1'24 Results: 3nm Revenue Share Drops Steeply, but HPC Share Rises
Taiwan Semiconductor Manufacturing Co. this week released its financial results for Q1 2024. Due to a rebound in demand for semiconductors, the company garned $18.87 billion in revenue for...
11 by on 4/19/2024ASML Patterns First Wafer Using High-NA EUV Tool, Ships Second High-NA Scanner
This week ASML is making two very important announcements related to their progress with high numerical aperature extreme ultraviolet lithography (High-NA EUV). First up, the company's High-NA EUV prototype...
13 by on 4/18/2024Samsung Unveils 10.7Gbps LPDDR5X Memory - The Fastest Yet
Samsung today has announced that they have developed an even faster generation of LPDDR5X memory that is set to top out at LPDDR5X-10700 speeds. The updated memory is slated...
6 by on 4/17/2024Samsung To Receive $6.4 Billion Under CHIPS Act to Build $40 Billion Fab in Texas
Samsung Electronics this week was awarded up to $6.4 billion from the U.S. government under the CHIPS and Science Act to build its new fab complex in Taylor, Texas...
5 by on 4/16/2024