Semiconductors
When Micron announced plans to build two new fabs in the U.S. in 2022, the company vaguely said both would come online by the decade's end. Then, in 2023, it began to optimize its spending, which pushed production at these fabrication facilities. This week, the company outlined more precise timeframes for when its fabs in Idaho and New York will start operations: this will happen from calendar 2026 to calendar 2029. "These fab construction investments are necessary to support supply growth for the latter half of this decade," a statement by Micron in its Q3 FY2024 financial results report reads. "This Idaho fab will not contribute to meaningful bit supply until fiscal 2027 and the New York construction capex is not expected to contribute to...
TSMC Posts Q1'24 Results: 3nm Revenue Share Drops Steeply, but HPC Share Rises
Taiwan Semiconductor Manufacturing Co. this week released its financial results for Q1 2024. Due to a rebound in demand for semiconductors, the company garned $18.87 billion in revenue for...
11 by Anton Shilov on 4/19/2024ASML Patterns First Wafer Using High-NA EUV Tool, Ships Second High-NA Scanner
This week ASML is making two very important announcements related to their progress with high numerical aperature extreme ultraviolet lithography (High-NA EUV). First up, the company's High-NA EUV prototype...
13 by Anton Shilov on 4/18/2024Samsung To Receive $6.4 Billion Under CHIPS Act to Build $40 Billion Fab in Texas
Samsung Electronics this week was awarded up to $6.4 billion from the U.S. government under the CHIPS and Science Act to build its new fab complex in Taylor, Texas...
5 by Anton Shilov on 4/16/2024TSMC to Receive $6.6B Under US CHIPS Act, Set to Build 2nm Fab in Arizona
TSMC has entered into a preliminary agreement with the U.S. Department of Commerce, securing up to $6.6 billion in direct funding and access to up to $5 billion in...
23 by Anton Shilov on 4/8/2024Rapidus to Get $3.9 Billion in Government Aid for 2nm, Multi-Chiplet Technologies
Rapidus, a Japan-based company developing 2nm process technology and aiming to commercialize it in 2027, will receive a huge government grant for its ongoing projects. The Japanese government will...
10 by Anton Shilov on 4/2/2024Construction of $106B SK hynix Mega Fab Site Moving Along, But At Slower Pace
When a major industry slowdown occurs, big companies tend to slowdown their mid-term and long-term capacity related investments. This is exactly what happened to SK hynix's Yongin Semiconductor Cluster...
8 by Anton Shilov on 3/23/2024Intel to Receive $8.5B in CHIPS Act Funding & Further Loans To Build US Fabs
Intel and the United States Department of Commerce announced on Wednesday that they had inked a preliminary agreement under which Intel will receive $8.5 billion in direct funding under...
20 by Anton Shilov on 3/20/2024NVIDIA's 'cuLitho' Computational Lithography Adopted By TSMC and Synopsys For Production Use
Last year, NVIDIA introduced its cuLitho software library, which promises to speed up photomask development by up to 40 times. Today, NVIDIA announced a partnership with TSMC and Synopsys...
21 by Anton Shilov on 3/18/2024ASML Delivers First 2nm-Generation Low-NA EUV Tool, the Twinscan NXE:3800E
Our avid readers tend to look at microelectronics made using leading edge process technologies, which in case of Intel means usage of High-NA extreme ultraviolet (EUV) lithography a couple...
2 by Anton Shilov on 3/13/2024Marvell's 2nm IP Platform Enables Custom Silicon for Datacenters
Marvell this week introduced its new IP technology platform specifically tailored for custom chips for accelerated infrastructure made on TSMC's 2nm-class process technologies (possibly including N2 and N2P). The...
0 by Anton Shilov on 3/8/2024Intel to Hold Webinar to Discuss Long-Term Vision for Foundry, Separating Fab and Design Reporting
As Intel prepares to move its fabs into its new Intel Foundry business, it will change the way it reports results in the coming months. To discuss the company's...
1 by Anton Shilov on 3/7/2024Arm and Samsung to Co-Develop 2nm GAA-Optimized Cortex Cores
Arm and Samsung this week announced their joint design-technology co-optimization (DTCO) program for Arm's next-generation Cortex general-purpose CPU cores as well as Samsung's next-generation process technology featuring gate-all-around (GAA...
3 by Anton Shilov on 2/22/2024IFS Reborn as Intel Foundry: Expanded Foundry Business Adds 14A Process To Roadmap
5 nodes in 4 years. This is what Intel CEO Pat Gelsinger promised Intel’s customers, investors, and the world at large back in 2021, when he laid out Intel’s...
29 by Ryan Smith on 2/21/2024GlobalFoundries to Receive $1.5 Billion In Funding from U.S. CHIPS Act
The United States Department of Commerce and GlobalFoundires announced on Monday that the US will be awarding GlobalFoundries with $1.5 billion in funding under the CHIPS and Science Act...
5 by Anton Shilov on 2/20/2024GlobalFoundries: Clients Are Migrating to Sub-10nm Faster Than Expected
When GlobalFoundries abandoned development of its 7 nm-class process technology in 2018 and refocused on specialty process technologies, it ceased pathfinding, research, and development of all technologies related to...
26 by Anton Shilov on 2/14/2024ASML to Ship Multiple High-NA Tools in 2025, Expands Production Capacities
ASML began to ship its first High-NA lithography tool to Intel late last year ,and the machine will be fully assembled in Oregon in the coming months. Shipping only...
8 by Anton Shilov on 2/14/2024Global Semiconductor Sales Hit $526.8 Billion in 2023
The global semiconductor industry saw its sales dropped around $47 billion to nearly $527 billion in 2023, according to estimations by the Semiconductor Industry Association (SIA). This was a...
13 by Anton Shilov on 2/9/2024TSMC to Build Second Fab in Japan: 6nm and 7nm Coming to Japan
Taiwan Semiconductor Manufacturing Co. on Tuesday formally announced plans to build a second fab in Japan. The fab will be run by Japan Advanced Semiconductor Manufacturing (JASM), a majority-owned...
4 by Anton Shilov on 2/6/2024Intel Teams Up with UMC for 12nm Fab Node at IFS
Intel and UMC on Thursday said they had entered into an agreement to jointly to develop a 12 nm photolithography process for high-growth markets such as mobile, communication infrastructure...
12 by Anton Shilov on 1/25/2024Intel's First High-Volume Foveros Packaging Facility, Fab 9, Starts Operations
Intel this week has started production at Fab 9, the company's latest and most advanced chip packaging plant. Joining Intel's growing collection of facilities in New Mexico, Fab 9...
2 by Anton Shilov on 1/25/2024