As the 2022 Flash Memory Summit continues, SK hynix is the latest vendor to announce their next generation of NAND flash memory at the show. Showcasing for the first time the company’s forthcoming 238 layer TLC NAND, which promises both improved density/capacity and improved bandwidth. At 238 layers, SK hynix has, at least for the moment, secured bragging rights for the greatest number of layers in a TLC NAND die – though with mass production not set to begin until 2023, it’s going to be a while until the company’s newest NAND shows up in retail products. Following closely on the heels of Micron’s 232L TLC NAND announcement last week, SK hynix is upping the ante ever so slightly with a 238 layer design. Though...
In a joint press release issued early this morning, SK Hynix and Intel have announced that Intel will be selling the entirety of its NAND memory business to SK...66 by Ryan Smith on 10/20/2020
SK Hynix today announced that they’ve begun sampling of its first ever PCIe 4.0 enterprise SSDs in the form of the new 96-layer 3D-NAND U.2/U.3 form-factor PE8010 and PE8030...40 by Andrei Frumusanu on 4/8/2020
Following a massive revenue and profitability drop in 2019, SK Hynix has announced that it plans to cut down its capital expenditures. While the market has shown some signs...6 by Anton Shilov on 2/3/2020
SK Hynix said that it would cut wafer starts of 3D NAND in the coming months more aggressively than it originally anticipated earlier this year. Besides, the company will...14 by Anton Shilov on 7/26/2019
SK Hynix has announced it has finished development of its 128-layer 1 terabit 3D TLC NAND flash. The new memory features the company’s charge trap flash (CTF) design, along...28 by Anton Shilov on 6/26/2019