APUs

While not the absolute first company in the market to talk about putting different types of silicon inside the same package, AMD’s launch of Ryzen 3000 back in July 2019 was a first in bringing high performance x86 computing through the medium of chiplets. The chiplet paradigm has worked out very well for the company, having high performance cores on optimized TSMC 7nm silicon, while farming the more analog operations to cheaper GlobalFoundries 14nm silicon, and building a high speed interconnect between them. Compared to a monolithic design, AMD ends up using the better process for each feature, smaller chips that afford better yields and binning, and the major cost adder becomes the packaging. But how low cost can these chiplet designs go? I...

Computex 2011: AMD Bulldozer, Llano, Trinity, & New VISION Branding

AMD’s Computex 2011 conference just wrapped up. Computex is not AMD’s traditional grounds for major new announcements – they’d rather have their own events for that – but alongside...

26 by Ryan Smith on 6/1/2011

Log in

Don't have an account? Sign up now